Study on microstructure and mechanical performance of copper/brass brazing joint with Ag brazing fillers

نویسندگان

چکیده

Ag is used as a useful alloying element in brazing filler metals. It clear that the addition of has positive effect on melting temperature, wettability, conductivity and mechanical property For this reason, although very expensive, it still widely many research production. In study, was focused obtaining both high strength cost-effective joints by using metals containing different levels Ag. Melting-solidification temperatures, properties microstructures obtained with Ag-Cu-Zn Cd were investigated. appropriate content processes pipes caps copper-brass material pairing cooling-heating devices air conditioning system investigated detail. When typical microstructure examined, observed mainly consisted solid solutions eutectic phases. The interfaces copper brass regions affected temperatures. As result burst test, maximum stress value at which brazed pairs damaged found to be 345 MPa, damage reported occur pipe. addition, been final product from zone when Ag-free solder wire used. 5%Ag provides sufficient performance due fact braze joint low-Ag higher than tube. results also showed micro-hardness increased increase Ag-addition, hardness metal 21%. 40% an up 57%. This improves strength, but its 5% joint.

برای دانلود رایگان متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Brazing & Soldering Today

Brazed components play an essential role in consistent joining techniques. The brazing process is characterized by low process temperatures and fast processing times, compared to welding techniques. Beside the resulting low manufacturing costs, brazing can join dissimilar materials, e.g. metals and ceramics. Consequently, brazing provides potential for many industrial applications like the prod...

متن کامل

Brazing & Soldering Today

JULY 2012 50 High-temperature solder alloys are extensively used in dieattach, power semiconductor, and optical device packaging, flip-chip packaging, etc. Current industry standard solders for these applications are mainly high-lead solders (90–97 wt-% Pb) and gold-based eutectic solder alloys such as the 80Au20Sn solder. The die-attach process involves connecting the silicon die or chips to a...

متن کامل

Developing and Easing the Brazing Method

Brazing generally require cumbersome apparatus be it induction, vacuum or torch brazing. In torch brazing, metals are joined by using the oxyacetylene cylinder. It thus becomes difficult to carry out brazing at the places where it is not possible to take heavy gas cylinders and brazing apparatuses. So it is tried to figure out the method to carry out brazing at places where conventional brazing...

متن کامل

Wettability of Brazing Filler Metals on Copper and Copper Alloys

The possibility of alloying can not be avoided at the interface between molten brazing filler metal and base metal in brazing, so the wettability of brazing filler metal can not be easily explained theoretically. We used the original apparatus for wettability test and investigated the relation between the wettability of brazing filler metals of Ag-P-Cu and Ag-Cu-Zn-Cd systems on copper and the ...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

ژورنال

عنوان ژورنال: Fen-mühendislik dergisi

سال: 2022

ISSN: ['1302-9304', '2547-958X']

DOI: https://doi.org/10.21205/deufmd.2022247230